Wafer Film Frame Tape Applicator

The item is sold AS IS without returns.

For parts or not working condition. It is not tested. 

Metal Sputter

Vacuum Wafer Transfer Robot Brooks Automation MagnaTran 7 Frogleg (MAG 7 F)

Wafer Transfer Robot and Aligner

Sputter System

Dual Arm Clean Robot Yaskawa Model: XU-RC350D-C03

2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.

New Surplus --  In original crate

Manual Photoresist Spin Coater

Canon FPA 3000 i5+

General Configuration:

• FPA 3000 - i5(+)
• Manufactured in  June / 1997
  • 8“ Wafer Chuck, Notch PA unit
  • 6“ Nikon-type Reticle Changer
  • Reticle Barcode-Reader =   yes
  • Cassette Barcode Reader = yes
  • Pellicle Particle Checker =   yes
  • Online - ESPA =   yes
  • Interface type:   right
  • Standard flys eye lens
  • Chamber type: CD80

Süss Micro Tec ACS200 Gen 3