The Mech-El/MEI 709 is a manual eutectic die attacher.  The machine comes with a  2 position slide table for die presentation and heated work holder.  The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.

Automatic Wedge Bonder

Manual Ball Bonder

Manual Wedge Bonder with Leica MZ6 Microscope

Manual Wedge Bonder with Leica GZ6 Microscope

Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically

Semiautomatic Epoxy Die Bonder

Ultrasonic Peg Bonder

Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation

Representative photo

Manual Wedge Bonder

Semi-Automatic Wedge Bonder Model 4500B operates under microprocessor control with user-programmed memory to stitch bond a succession of parallel multi-arch wires, requiring an operator only to position the critical bond target. Each increment of motion of tool and work in both Z and Y directions is chosen by stepper motors under program control so that the resulting wire connections have identical shapes. This is ideal for bonding high power, high frequency devices where it is necessary to hold the mutual inductance of parallel wires constant.

Manual Ball Bonder